Heat Sink Calculator

Calculate heat sink thermal resistance, fin array performance, and required airflow for electronics cooling.

Total heat to be removed from the component.
W
Surrounding air temperature.
°C
Maximum allowable device temperature.
°C
From component datasheet.
°C/W
Thermal pad/grease. Good: 0.2-0.5 °C/W.
°C/W

Results

Max Sink-to-Ambient Resistance-°C/W
Total Junction-to-Ambient-°C/W
Junction Temperature-°C
Temperature Margin-°C
References: Ellison — Thermal Computations; Cengel — Heat Transfer